High-Quality CVD and PVD Crystal Growth
Doping and Band Alignment Engineering
Flip-Chip Packaging with Elimination of Solder Flux and Formic Acid Pre-Treatment
Wire Bonding Packaging with Elimination of Corrosion Defects
Electronic and Electroluminescent Devices
Multi-Beam Lens and Reconfigurable Phased-Array Antennas
2D-3D AM Integration of Electronic Ceramics, Composites and Metals