High-Quality CVD and PVD Crystal Growth

Doping and Band Alignment Engineering

Flip-Chip Packaging with Elimination of Solder Flux and Formic Acid Pre-Treatment

Wire Bonding Packaging with Elimination of Corrosion Defects

Electronic and Electroluminescent Devices

Multi-Beam Lens and Reconfigurable Phased-Array Antennas

2D-3D AM Integration of Electronic Ceramics, Composites and Metals
